| Device model | K3205 |
| Detection capacity | Detection items | Miss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset |
| Scanning method | Stop&Go |
| Optical system | Camera | 5MP high speed color industrial camera |
| Light Source | Dual DLP light source (raster phase shift technology) and red, green and blue (RGB) light source |
| Resolution | 10μm & 15um (optional) |
| Detection performance | Height accuracy (calibration module) | 1μm (using standard calibration block) |
| Volume repeatability | <1% (standard verification block, 3Sigma) |
| Maximum Plate Bending Compensation Value | ±3mm |
| Detection Capability GRR | <10%at6o(+50%tolerance, 5μm resolution) |
| Maximum detection height | 500μm |
| Solution to shadow problem | Phase shift technology & bidirectional 3D Structured Light system |
| Plate bending real-time compensation method | Plate Bend Compensation (Z-Tracking+Pad Referencing) |
| Test screen | Color (3D and 2D images displayed together) |
| Driving equipment | Servomotor+Screw Guide |
| Moving speed | 800mm/s |
| Minimum measurable product size | 50mmx50mm |
| Maximum product measurable size | 400mmx500mm |
| PCB thickness | 0.5~6mm |
| Track width adjustment | Automatic width adjustment, manual width adjustment |
| Circuit board conveying/fixing | Belt conveyor/pneumatic clamp fixing |
| Conveying direction | From left to right, right to left |
| Orbital height | 900±20mm |
| Computer Configuration | Mainframe | CPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T |
| Monitor | 22"LED |
| Operating system | Ubuntu |
| Parameters | Overall size | W1350xD1000xH1600mm (excluding alarm light) |
| Weight | 1100KG |
| Power source | AC220V/50~60Hz/2000W |
| Air Pressure | 0.5Mpa |
| Software Supported Input Formats | Support Gerber format (274X), ODB++ |
| Statistical management tools | Histogram,X-bar&R -Chart ,X-bar&S -C hart ,C p&C pk, %Gage R & R,SPI Daily/Weekly/Monthly Reports, real-time SPC& Multiple Display |
| Environmental requirements | Temperature: 5~40℃, relative humidity: 25%~80% (no frost) |
| Upstream and downstream equipment communication | Standard SMEMA interface |
